Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis

  • <0.5um Feature Recognition
  • 160kV Nordson Dage NT500 Sealed Transmissive X-Ray tube
  • Geometric Magnification 1,800X, System 7,800X, and Total 23,400X with Digital Zoom
  • 29” x 22.8” (736mm x 580mm) Maximum Board Size
  • 70 degree Oblique Views without Loss of Magnification
  • X-Plane Technology Allows Inspection in Any Plane Without Cutting the Board
  • View as many as 720 Individual 2D Slices Within a Sample from Top-to-Bottom, Front-to-Back, Left-to-Right, and any plane in between
  • Showing position and size of voids a joint interfaces and other locations within BGA, CSP, QFN, LGA, etc.
  • Identifies Head on Pillow (HoP) and open joints
  • Separating and inspecting the different layers within a Package-on-Package (PoP) or MCM
  • Removing obscuring detail caused by side 2 features when needing to inspect side 1 components
  • Investigating the quality and fill of thru-hole joints and vias
  • Identifying tilted components and board warpage
  • Analyzing connectors
  • Examining the tracks in individual board layers
  • Making virtual micro-sections